For design teams adopting 3D-IC architectures, the relentless pursuit of performance and reliability brings a familiar, yet ...

We're all familiar with two dimensional design drawings — not to mention the questions that usually accompany them because they can provide only so much information before becoming hopelessly ...

The diversity of 3D multi-die design further complicates IP requirements. Common topologies, including face-to-face (F2F), ...

The semiconductor industry is at a pivotal moment as the limits of Moore’s Law motivate a transition to three-dimensional integrated circuit (3D IC) technology. By vertically integrating multiple ...

The relentless pursuit of higher performance and greater functionality has propelled the semiconductor industry through several transformative eras. The most recent shift is from traditional ...

Samuel Silberman, an incoming PhD student in electrical engineering, has been named a 2025 Draper Scholar by Draper. The prestigious graduate fellowship will support his research into radio frequency ...