Over the past few decades, polydimethylsiloxane (PDMS) has become the material of choice for a variety of microsystem applications, including microfluidics, imprint lithography, and soft microrobotics ...

In this technique, fluorine-based plasma chemistry is used for silicon etching, which is combined with a fluorocarbon plasma process to offer sidewall passivation and enhanced selectivity to masking ...

In dry etching, the trajectory of accelerated ions is non-uniform and non-vertical, due to collisions with gas molecules and other random thermal effects (figure 1). This has an impact on etch results ...

After years in R&D, a technology called cryogenic etch is re-emerging as a possible option for production as the industry faces new challenges in memory and logic. Cryogenic etch removes materials in ...

Deep reactive ion etching (DRIE) is a highly anisotropic plasma etching process that creates deep, near-vertical features in silicon and related microfabrication materials. DRIE extends ordinary ...

A team of physicists has uncovered some of the physics that make possible the etching of silicon computer chips, which power cell phones, computers, and a huge range of electronic devices. Physicist ...

After more than a decade of research and development, Tokyo Electron Miyagi Ltd. has introduced an innovative semiconductor etching method that achieves etch rates up to five times faster than ...

BANGALORE, India, Jan. 6, 2026 /PRNewswire/ -- The Global Semiconductor Etch Equipment Market revenue was USD 22730 Million in 2022 and is forecast to a readjusted size of USD 49330 Million by 2029 ...