A new technical paper titled “Ramping Up Open-Source RISC-V Cores: Assessing the Energy Efficiency of Superscalar, ...

Multi-die assemblies enable more analog content, but that adds new security vulnerabilities for which there is little ...

Edge AI, GenAI, and next-gen communications are adding more workloads to phones that are already under pressure to deliver ...

Reworking chip grants; global semi, equipment sales up; GF's $16B expansion; Arm's AI-defined vehicles platform; Mexico's ...

Smart glasses with augmented reality functions look more natural than VR goggles, but today they are heavily reliant on a ...

Commercialization has started for network switches based on co-packaged optics (CPO), which are capable of routing signals at ...

A recent technical paper titled “Factors determining bond wave speed in wafer bonding” was published by researcher at ...

PMJ 2025 was more than just a successful event—it was a clear signal that the photomask and eBeam communities are growing, ...

Today, we are witnessing a paradigm shift towards a more modular design approach that disaggregates SoC functions into ...

The researchers used it to map stray magnetic fields from CoFeB–SiO2 thin films used in high-frequency inductors. They ...

Broad Range of Potential Attacks: If an attacker is able to gain access to data on an Ethernet connection, a range of attacks ...

A new technical paper titled “What Is Next for LLMs? Next-Generation AI Computing Hardware Using Photonic Chips” was ...