EMLC and 30 years of leadership by Dr. Behringer – all a good reason for a brief review. EMLC was first held in Munich in 1986, as a more or less national meeting of scientists and engineers from the ...

In the world of EDA, Jay Vleeschhouwer, managing director of software research at Griffin Securities, needs no introduction.

Flip chip lidded ball grid array (FCLBGA) packaging technology, which is commonly used in high-performance computing ...

Certain non-killer but marginal wafer defects can escape detection if they have sufficient electrical connectivity.

Rationale and guidance for acquiring and maintaining SEMI E187-0122 tool equipment cybersecurity compliance. Cyber threats ...

AI and HPC are fueling much-needed investment in panel-level tooling and processes. An insatiable demand for logic to memory integration for AI and high-performance computing is driving progress ...

What is CMOS 2.0? At its core, CMOS 2.0 is an effort to move beyond the limitations of a single monolithic die. Rather than ...

Despite the AI hype, tools are proving valuable for leading-edge chip manufacturing. More aggressive feature scaling and ...

A new technical paper titled “Augmenting Von Neumann’s Architecture for an Intelligent Future” was published by researchers ...

A chiplet ecosystem is under development, but many barriers must be overcome before a thriving marketplace can exist.

Before the transition can be made from custom chiplet environments to a standardized off-the-shelf open marketplace, an ecosystem must be created.

Synopsys’ Vincent van der Leest and Mike Borza argue that hardware security is critical for providing the foundational trust, ...