Discover the features of the Arm AGI CPU, including up to 136 cores, low latency, and scalability for AI tasks.

Efficient Power Conversion (EPC) released its Phase 18 Reliability Report, which describes updated approaches for evaluating eGaN device reliability across application mission profiles. The report ...

The 800 VDC power architecture from Texas Instruments is designed for AI data centers using the NVIDIA 800 VDC reference ...

The Intel® Core™ Ultra 200HX Plus series from Intel includes mobile processors such as the Core Ultra 9 290HX Plus and Core ...

The DCP3603 from STMicroelectronics is a monolithic buck converter that delivers up to 3 A from a 3 mm × 1.6 mm footprint, ...

The Structera™ S 60260 PCIe 6.0 switch from Marvell is a 260-lane device designed to support scale-up interconnects in AI ...

The BZPACK mSiC® power modules from Microchip Technology are silicon carbide-based modules designed to meet High Humidity High Voltage High Temperature Reverse Bias standards for industrial and ...

Nordic Semiconductor had a busy Embedded World. Four product announcements in a single week, all centered lower power ...

When engineers hear the phrase LiDAR, an acronym for Light Detection and Ranging, they generally think of time-of-flight (ToF ...

The Eclipse Foundation had a lot to cover at Embedded World 2026 in Nuremberg, and most of it pointed in the same direction: ...

Explore the latest insights from Microchip at Embedded World 2026 and learn about its strategic evolution for design ...

Explore the Eclipse Foundation's impact on open source at Embedded World 2026, highlighting advancements in automotive and ...